Various causes and countermeasures for SMT patch BGA solder joint breakage

SMT (Surface Mount Technology) is an assembly technology widely used in the field of modern electronic manufacturing and is commonly used in the manufacturing process of electronic products. BGA (Ball Grid Array) is a common packaging type and is widely used in SMT patches. However, due to various factors, the SMT patch BGA solder joints may break.

1. SMT chip furnace temperature problem: Welding temperature is one of the important factors affecting the quality of SMT chip solder joints. If the temperature is too high or too low, it may cause solder joint breakage or poor welding. The countermeasure is to reasonably control the welding temperature to ensure welding is within an appropriate temperature range. In addition, the use of high-quality solder paste and the correct process can also improve the strength of solder joints.

2. PCB design issues: Design issues may also cause solder joints to break. For example, the design of the PCB board is unreasonable, the shape of the pad is improper, or the wiring is poor. The countermeasure is to improve the quality of solder joints by optimizing the design, ensuring that the shape and size of the pads meet the requirements, and at the same time improving the structural strength of the PCB board.

3. Mechanical stress: Mechanical stress refers to the deformation of the BGA solder joints of the SMT patch caused by external forces or vibrations during use or transportation. This mechanical stress can cause solder joints to break. The countermeasure is to fully consider the impact of mechanical stress when designing products, and use appropriate protective measures such as buffer materials or shock-absorbing devices to relieve the stress on solder joints.

4. PCB board material issue: PCB board material will also affect the quality of solder joints. If the selected PCB board material is too fragile or has insufficient rigidity, it may cause the solder joints to break. The countermeasure is to select a suitable PCB board material to ensure that it has sufficient stiffness and toughness to reduce the risk of solder joint breakage.

5. Problems with the SMT patch process: The SMT patch process is multi-faceted and complex, and poor technology is also a cause of solder joint breakage. For example, irregular operations during the welding process, instability of equipment, etc. The countermeasure is to strengthen employee training to ensure operating specifications, while regularly inspecting and maintaining welding equipment to ensure the stability and reliability of its work.

6. SMT patch environmental factors: SMT patch environmental factors may also affect the quality of solder joints. For example, excessive humidity or the presence of corrosive gases can cause solder joints to break. The countermeasure is to maintain appropriate environmental conditions during the welding process, such as controlling humidity and preventing the intrusion of corrosive gases.

To sum up, to avoid SMT patch BGA solder joint breakage, it is necessary to comprehensively consider various factors such as temperature, design, mechanical stress, PCB board material, process, and environmental factors. Through reasonable process control, design optimization, and strengthened quality management, the strength and reliability of solder joints can be improved and the risk of solder joint fractures can be reduced. This ensures the quality and reliability of electronic products, ultimately improving user satisfaction.

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