How to deal with the bulk materials of SMT patches?

The bulk materials of SMT patches refer to components that are separated from the original packaging due to machine throwing or assembly and disassembly of materials during the production process. Whether it is an order for the SMT patch factory to contract the work and materials themselves or an order for the materials provided by the customer, the quantity provided for many Class A materials is just right, so the bulk materials must be rearranged and patched on the PCBA surface during the order clearance process. Some bulk materials, such as capacitors, resistors, inductors, and other devices, have little value and have no reuse value, so they can be ignored. However, there are some imported chip components that are very valuable and easy to distinguish, so they are Classes are generally reused. Therefore, we need to have the correct method of handling bulk materials. Strengthen the control of SMT patch bulk materials to prevent poor operations caused by mounting bulk materials.

1. Responsibilities of each SMT position in cleaning bulk materials

Operator: Responsible for the collection, classification, labeling, storage, placement, and placement information transmission of SMT patch clearance bulk materials.   Furnace QC: Responsible for manual placement of SMT patch clearance bulk materials, confirmation of back pattern and material coding before placement, and PCBA marking.   Line leader: Responsible for supervising operators to complete operations according to procedures and manage bulk materials.   Inspector: Responsible for confirmation inspection of the first piece of bulk materials and inspection of PCBA marking status.

2. Specific work content of SMT patch removal bulk materials

1. During the SMT patching process, materials may be thrown due to equipment and other factors, resulting in the generation of bulk materials. Therefore, during the operation, the operator should check the material step distance before SMT patching, during shift handover, and every time when taking out the garbage. Throwing boxes and trash cans to collect bulk materials, and at the same time report to the line leader any abnormal situations involving excessive bulk materials.

2. Classify the bulk materials according to the appearance of the components, and check the back pattern of the components to determine the material code. Then package the checked bulk materials in anti-static bulk boxes or bulk bags, and mark the material codes. Related Signature of the confirming person.

3. First collect a certain length of used braid and one, and then use double-sided tape to stick the braid to the position where the chip placement machine can normally absorb materials. It is best to ensure that the position of the material trough is aligned. Then compile a program that can use the pallet, so that the machine can be mounted effectively, quickly, and accurately.

4. For manual placement of materials, operators need to mark the placement machine so that the status is clear in front of the furnace. The furnace QC will check the prototype when starting to mount the first piece of bulk material.

In addition, in SMT chip processing, normal incoming materials are generally packed with trays as carriers and small batch orders are generally packed with tapes as carriers, but bulk materials are different. Bulk materials cannot be processed without tapes as carriers. Directly machined. Regarding the problem of bulk materials, the SMT patch processing manufacturer needs to be manually sorted before starting SMT patching. This part will cost more labor costs, which is detrimental to the overall SMT operating cost and will delay more The production efficiency may even lead to delivery delays. Many SMT chip processing manufacturers will charge additional labor fees for orders with serious bulk materials.

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