Low Cost Optical BGA Rework Station WDS-620

Low Cost Optical BGA Rework Station WDS-620

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Low Cost Optical BGA Rework Station

  • HD display
  • Independent 3 heating zones temperature control system
  • Real-time Temperature Detection
  • Precision optical alignment system
SKU: BR2023032201 Categories: ,

Low Cost Optical BGA Rework Station

HD display

High-definition adjustable CCD (2 million pixels) digital imaging automatic optical zoom system, automatic precise alignment control with laser red dot, using a 15-inch high-definition industrial display screen.

Independent 3 heating zones temperature control system

Three heating zones heating independent, upper and down heating zones both hot air heating, bottom IR heating, temperature precision control within +1CUpper heating zone can move freely as required. The second heating zone can adjust t. The upper and lower heaters can be set up for multi-stage temperature control at the same time. R preheating zone can adjust output power according to actual requirements High-precision K-type thermocouple close-loop control and PID parameter self-setting system;

Real-time Temperature Detection

The real-time temperature display can be used to analyze and proofread the actual BGA temperature curve at any time and analyze, set, and correct the temperature parameter curve on the touch screen at any time;

Precision optical alignment system

The high-definition adjustable CCD color optical visual alignment system has the functions of light splitting, zoom in, zoom out, and auto-focusing, and is equipped with automatic color difference resolution and brightness adjustment devices, It Manually controls alignment with the laser red dot.

Specifications of Low Cost Optical BGA Rework Station

Model WDS-620
Power supply Ac220v士10%,50/60hz
Total power 5200W
Heater power supply Upper hot air heater, Max 1200W
Down hot air heater, Max 1200W
IR heater, Max 2700w
Suitable PCB size Max 470 x 380mm Min 10 x 10 mm
Applicable chip size Max70 x 70mm Min 1 x 1 mm
Applicable PCB thickness 0.3-5mm
Mounting precision 士0.01mm
Temperature measuring interface 1pcs
Maximum mounting load 150G
Overall dimensions L650x W630xH850mm
Machine weight About 55kg

What is BGA?

ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package’s leads to the wires or balls that connect the die to the package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds..

Check more at: https://en.wikipedia.org/wiki/Ball_grid_array

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