Mini Wave Soldering Machine For DIP

Mini Wave Soldering Machine For DIP


Mini Wave Soldering Machine For DIP

  • Automatic conveying system.
  • Wave height can be controlled.
  • Controlled by PLC.
  • High heating speed.
  • Special alloy conveyor chain claws.
  • High-frequency and variable frequency motors.
  • Lead-free soldering.
  • The time is controllable.
  • Automatic paw cleaning function.
  • High security.


SKU: WS2023040401 Categories: ,

Mini Wave Soldering Machine For DIP, great price and quality ratio wave soldering machine solution from SZTech-SMT.


1. Automatic conveying power system and automatic synchronous board feeding function.
2. The wave soldering peak adopts frequency conversion speed regulation, which can independently control the wave height.
3. The flux spraying system adopts scanning Japanese nozzles, and rodless cylinders, controlled by PLC, which is accurate and reliable.
4. Adopt PLC to control the machine to ensure the reliability and stability of the system.
5. The long-distance infrared ceramic heating tube preheating device is adopted, and the heat is directly radiated to the bottom of the circuit board, which rapidly heats up and stimulates the full activity of the flux.
6. Special alloy conveyor chain claws, and non-stick tin, ensure the quality of soldered PCB board.
7. The tin furnace is independently controlled by imported high-frequency variable frequency motors, with stable performance.
8. The self-designed lead-free soldering furnace is environmentally friendly, safe, and easy to clean.
9. The preheating system adopts three-way independent temperature control, which has good heat preservation, and uniform temperature, and the temperature difference does not exceed ±2ºC.
10. The time is controllable, the switch function can be preset, and the tin furnace can be heated within 90 minutes.
11. The automatic paw cleaning function ensures the cleanliness of the paws.
12. Reasonable design and sensitive fail-safe alarm system ensure stable performance and safety of operators.

Main specifications of Mini Wave Soldering Machine





General specification

Weight: Approximately:700kg
Start-Up Power: Approx 11KW
Normal running power:4-6 KW
Power supply :3ph,AC380V/220V 50HZ
Control systems: key Penal





Conveyor systems

Direction: Left to Right, Front Fix(R to L)
MAX PCB Size:400mm
Titanium Alloy V shape Finger
300mm PCB loading buffer at the entrance
Control method: Motor(Panasonic)
PCB Component Height” Top 120mm bottom:15mm




Spay Flux Systems

Stepper motor drive reciprocating Spray
7-UP ST-8 Nozzles
The capacity of Flux is 3.5/liter
Spary air pressure:3-5bar
Modular structure for easy maintenance


Heating system

Heating zones: Bottom 2 zones,
The Length of heating zones:800mm
Heating method: Forces hot air
Heating zones modularization easy to maintenance


Solder pot

The capacity of solder pot:220KG
Two waves: Turbulence Wave and Lambda 2nd Wave
Materials: Titanium alloy
Cleaning Finger systems.



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