Several basic strategies are recommended for PCBA processing in automotive electronics

In recent years, with the development of new energy vehicles, PCBA processing has become more and more important in automotive electronics, but with the shortage of automotive electronic chips, many brands of cars have been unable to deliver. Especially this year, the chips of the engine ECU control module; system interaction module; and GPS positioning module are particularly short, which also poses certain challenges to our patch factories specializing in automotive electronic SMT patch processing.

However, the process of automotive electronic pcba processing and assembly must also be improved with the improvement of automotive electronic technology to meet the requirements of applicable automotive-grade standards. Therefore, it is recommended to follow the following basic strategies in the SMT processing of automotive circuit boards.

First of all, automotive electronics has its own strict quality system in the industry:

Automotive electronics PCBA processing plants should comply with the provisions of the IATF16949 quality system, which is a set of technical regulations for the global automotive industry. Based on the special requirements of the automotive industry, it focuses more on defect prevention, reducing quality fluctuations and waste that is easy to generate in the automotive parts supply chain. When implementing ISO/IATF16949, special attention must be paid to the following 5 main tools: PPAP (Production Part Approval Process), which stipulates that the product should be approved by the customer before mass production or after modification; APQP (Advanced Product Quality Plan), which stipulates that quality planning and previous quality analysis should be carried out before production, and then FMEA (Failure Mode and Effect Analysis) analysis should be carried out and measures to prevent potential product failures should be proposed, MSA (Measurement System Analysis) must analyze the changes in measurement results to confirm measurement reliability, SPC (Statistical Process Control) master production procedures and use statistical techniques to change product quality. Therefore, the first step for PCBA processing plants to enter the automotive electronics market is to obtain IATF16949 certificates.

The direction of component placement plays an important role in the performance, reliability, and functionality of PCBA circuit board manufacturing. When using wave soldering, the components must be oriented in a direction parallel to the wave crest to prevent bridging soldering or open circuits.

Automotive electronics have many control modules that require signal transmission. It is necessary for us to protect sensitive signals (such as communication modules) from electrical radiation interference through planes and controlled impedance. 2 to 4 vias per layer must be used for connections between high-current layers; in fact, using multiple vias on a PCB can improve reliability, reduce resistance and inductance losses and increase thermal efficiency.

Components rated at more than 10mW or more than 10mA must require proper thermal management and power management components. Power and ground planes must be placed on inner layers. Symmetrical and centered to prevent bending of the board. The first step consists of identifying the components with the most significant heat generation and calculating what thermal management measures to take. Therefore, trace thickness, number of layers, thermal path continuity, and board surface must be strictly controlled as factors that affect the climate of the working components.

Thermal vias have the same effect as copper fields. Both tend to increase conductivity. Using multiple soil areas and power connected directly to the heat source through thermal vias can significantly reduce the operating temperature. If multiple components generate a lot of heat, it is best to distribute it evenly on the board to avoid hot spots. On the other hand, if the heat generators are concentrated in multiple components, it is best to place them in the middle of the board so that the heat is evenly dispersed in all directions.

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