What role does X-ray inspection equipment play in the SMT processing industry?

X-ray, also called X-ray or X-ray, is used in daily life when we often go to the hospital for X-ray inspection. In the electronic manufacturing and processing industry, we usually call it an X-ray inspection machine or inspection equipment. It mainly uses the principle of X-ray to scan and image the inside of the product to detect defects inside the product, such as cracks, foreign matter, etc. So what role does X-ray inspection equipment play in the SMT processing industry?

In recent years, electronic products have developed rapidly, IC integrated circuit technology has developed rapidly, and more and more electronic products have become miniaturized, lightweight, and precise, which has led to smaller and smaller motherboards inside electronic products. Therefore, the components in such products tend to be packaged, resulting in a large number of IC and BGA patch requirements. The pins of such ICs are more and more numerous, thinner, and denser, and ICs such as BGA and CPU are hemispherical and located at the bottom. The quality after reflow soldering cannot be seen by the naked eye. Therefore, to check the welding quality of such ICs, X-ray inspection equipment must be used.

In the past, reflow soldering inspection was basically done manually or by AOI, which can detect the welding quality of daily ICs (such as QFP/SOP). Because the pins of such ICs are exposed to the outside, AOI can detect the welding quality. However, as the pins are at the bottom and inside of the IC (such as BGA/QFN), AOI and the naked eye cannot detect the welding quality. Therefore, an X-RAY is needed to determine whether the solder ball is welded properly through the light spot formed by X-ray penetration and whether there are any problems such as false soldering and cold soldering.

The importance and advantages of X-ray compared to other inspection equipment:

1. The coverage rate of welding process defect detection reaches 98%, especially the advantage of X-ray in inspecting hidden devices such as BGA and CSP solder joints.

2. Large detection range, wide coverage, and early detection of good materials: If the PCBA is judged to be faulty and it is suspected that the inner layer of the PCB is broken, an X-ray can be inspected quickly, or BGA/CSP and other materials can be detected in advance to find defects, avoiding defective materials from flowing into the production line, causing rework, and wasting manpower and material resources.

3. It has higher stability and reliability test defect analysis, such as internal solder joints, air holes and poor molding, etc.

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